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PRELIMINARY CM1450 LCD & Camera EMI Filter Array with ESD Protection
Features
* * * * * * * * * * Six and eight channels of EMI filtering Utilizes PraetorianTM inductor-based design technology for true L-C filter implementation OptiGuardTM coating for improved reliability 15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) 30kV ESD protection on each channel (HBM) Better than 40dB of attenuation at 1GHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 15-bump, 2.960mm x 1.330mm footprint Chip Scale Package (CM1450-06CS/CP) 20-bump, 4.000mm x 1.458mm footprint Chip Scale Package (CM1450-08CS/CP) Lead-free version available
Product Description
The CM1450 comprises a family of inductor-capacitor (L-C) based EMI filter arrays with integrated ESD protection in CSP form factor. The CM1450-06 and CM1450-08 are configured in 6 and 8 channel formats respectively. Each EMI filter channel of the CM1450 is implemented as a 5-pole L-C filter where the component values are 15pF-17nH-15pF-17nF-15pF. The CM1450's roll-off frequency at -10dB attenuation is 300MHz and can be used in applications where the data rates are as high as 120Mbps while providing greater than 35dB over the 800MHz to 2.7GHz frequency range. The parts integrate ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of 15kV, beyond the Level 4 requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than 30kV. This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs) because of its small package format and easy-to-use pin assignments. In particular, the CM1450 is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in wireless handsets. The CM1450 incorporates OptiGuardTM which results in improved reliability at assembly. The CM1450 is available in a space saving, low profile Chip Scale Package with optional lead-free finishing. .
Applications
* * * * * * LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. EMI filtering for data phones in cell phones, PDAs or notebook computersWireless handsets / cell phones Wireless Handsets Handheld PCs/PDAs LCD and camera modules
Electrical Schematic
L1 L2
FILTERn*
C C C
FILTERn*
GND (Pins B1-Bn)
1 of n EMI Filtering + ESD Channels (n = 6 for CM1450-06, 8 for CM1450-08)
(c) 2005 California Micro Devices Corp. All rights reserved. 01/27/05
* See Package/Pinout Diagram for expanded pin information.
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
1
PRELIMINARY CM1450
PACKAGE / PINOUT DIAGRAMS (Bumps Down View)
Orientation Marking (see note 2)
TOP VIEW
3 4 5
BOTTOM VIEW
(Bumps Up View)
FILTER3 FILTER4 FILTER5 FILTER1 FILTER2 FILTER6
1 A B C
2
6
C1
GND
C2 B1
C3
GND
C4 B2
C5
GND
C6 B3
N506
2 3 4 5 6 7 8
Orientation Marking
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
A1
A1
A2
A3
A4
A5
A6
CM1450-06CS/CP 15-Bump CSP Package
Orientation Marking (see note 2)
1 A B C
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
C1
C2
GND
C3
GND
C4 B2
C5
GND
C6 B3
C7
GND
C8 B4
N508
Orientation Marking
B1
FILTER1 FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
A1
A1
A2
A3
A4
A5
A6
A7
A8
Notes: CM1450 -08CS/CP 20-Bump CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
CM1450 PIN(s) A1 A2 A3 A4 A5 A6 B1-B3 CM1450 PIN(s) A1 A2 A3 A4 A5 A6 A7 A8 B1-B4 NAME NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 GND DESCRIPTION DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Filter Channel 7 Filter Channel 8 Device Ground CM1450 PIN(s) C1 C2 C3 C4 C5 C6 CM1450 PIN(s) C1 C2 C3 C4 C5 C6 C7 C8 NAME NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 DESCRIPTION DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Filter Channel 7 Filter Channel 8
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Bumps 15 20 Package CSP CSP Ordering Part Number1 CM1450-06CS CM1450-08CS Part Marking N506 N508 Lead-free Finish2 Ordering Part Number1 CM1450-06CP CM1450-08CP Part Marking N506 N508
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2005 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
01/27/05
PRELIMINARY CM1450
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 500 UNITS C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
SYMBOL LTOT L1, L2 CTOT PARAMETER Total Channel Inductance (L1 + L2) Inductance Total Channel Capcitance (C1C2 C3 ) At 2.5V DC, 1MHz, 30mV AC At 2.5V DC, 1MHz, 30mV AC 36 12 CONDITIONS MIN TYP 34 17 45 15 54 18 MAX UNITS nH nH pF pF
C1, C2, C3 Capacitance
fC fC
VDIODE ILEAK VSIG
Cut-off Frequency ZSOURCE=50, ZLOAD=50 Roll-off Frequency at -10dB Attenuation ZSOURCE=50, ZLOAD=50 Diode Standoff Voltage Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients IDIODE=10A VDIODE=+3.3V ILOAD = 10mA 5.6 -1.5 30 15 Notes 2,3,4 and 5 5.5
137 300 100 6.8 -0.8 9.0 -0.4
MHz MHz V nA V V kV kV
VESD
Notes 2,4 and 5
VCL
+12 -7
V V
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization.
(c) 2005 California Micro Devices Corp. All rights reserved. 01/27/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
3
PRELIMINARY CM1450
Performance Information
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1)
Figure 2. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25C)
(c) 2005 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
01/27/05
PRELIMINARY CM1450
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260C
Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 4. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2005 California Micro Devices Corp. All rights reserved. 01/27/05
Figure 5. Lead-free (SnAgCu) Solder Ball Reflow Profile
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
5
PRELIMINARY CM1450
Mechanical Details
CM1450 devices are supplied in custom Chip Scale Packages (CSP). Dimensions for each of these devices are presented in the following pages. CM1450-06CS/CP Mechanical Specifications The package dimensions for the CM1450-06CS/CP are presented below.
C1
Mechanical Package Diagrams
BOTTOM VIEW
A1 B1 C B2 B4 B3
SIDE VIEW
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 15 Inches Nom Max
B A 1 2 3 4 5 6
A2
C2 D1 D2
2.915 2.960 3.005 0.1148 0.1165 0.1183 1.285 1.330 1.375 0.0506 0.0524 0.0541 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.561 0.605 0.649 0.0221 0.0238 0.0255 0.355 0.380 0.405 0.0140 0.0150 0.0159 3500 pieces
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1450-06CS/CP Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
(c) 2005 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
01/27/05
PRELIMINARY CM1450
Mechanical Details (cont'd)
CM1450-08CS/CP Mechanical Specifications The package dimensions for the CM1450-08CS/CP are presented below.
C1
Mechanical Package Diagrams
BOTTOM VIEW
A1 B1 C B A 1 A 2 3 4 5 6 7 8 D1 D2 A2 C2 B2 B4 B3
SIDE VIEW
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 20 Inches Nom Max
3.955 4.000 4.045 0.1557 0.1575 0.1593 1.413 1.458 1.503 0.0556 0.0574 0.0592 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.200 0.250 0.300 0.0079 0.0098 0.0118 0.244 0.294 0.344 0.0096 0.0116 0.0135 0.561 0.605 0.649 0.0221 0.0238 0.0255 0.355 0.380 0.405 0.0140 0.0150 0.0159 3500 pieces
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1450-08CS/CP Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
(c) 2005 California Micro Devices Corp. All rights reserved. 01/27/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
7
PRELIMINARY CM1450
Mechanical Details (cont'd)
CSP Tape and Reel Specifications
PART NUMBER CM1450-06 CM1450-08 CHIP SIZE (mm) 2.96 X 1.33 X 0.6 4.00 X 1.46 X 0.6 POCKET SIZE (mm) B 0 X A0 X K0 3.10 X 1.45 X 0.74 4.11 X 1.57 X 0.76 TAPE WIDTH W 8mm 8mm REEL DIAMETER 178mm (7") 178mm (7")
10 Pitches Cumulative Tolerance On Tape 0.2 mm
QTY PER REEL 3500 3500
P0 4mm 4mm
P1 4mm 4mm
Po Top Cover Tape
Ao W Bo
Ko
For Tape Feeder Reference Only including Draft. Concentric Around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 6. Tape and Reel Mechanical Data
(c) 2005 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
01/27/05

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